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材料命名规则: GapPad3000S30=（GAPPADTGP3000）
Bergquist GapPad3000S30（GAPPADTGP3000）柔软有基材间隙填充导热材料
产品关键词：GapPad3000S30，GAPPADTGP3000，贝格斯GP3000S30,贝格斯3000，格斯导热材料，贝格斯，贝格斯导热绝缘片，贝格斯导热绝缘垫片，贝格斯硅胶片，贝格斯导热硅胶片，贝格斯高导热硅胶片，贝格斯散热片，贝格斯矽胶片，贝格斯导热矽胶片，贝格斯导热贴，贝格斯材料
材料生产商：美国贝格斯（BERGQUIST）公司研发产品
GapPad3000S30（GAPPADTGP3000）可供规格：
厚度(Thickness)：0.25mm 0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm
片材(Sheet)： 8”×16”（203×406mm)
卷材(Roll)：无
导热系数(Thermal Conductivity)：3.0W/m-k
基材(Reinfrcement Carrier)：玻璃纤维
胶面(Glue)：双面自带粘性
颜色(Color)：浅绿色
包装(Pack)：美国原装进口包装
抗击穿电压(Dielectic Breakdown Voltage)（Vac）:＞3000
持续使用温度（Continous Use Temp）：-60°~200°
GapPad3000S30（GAPPADTGP3000）应用材料特性：
GapPad3000S30（GAPPADTGP3000）在非常低的压力下，低的S系列热阻，高的贴服性，S系列软度。针对低应力应用设计
玻纤增强，提高加工性能和搞斯裂性
Gap Pad 3000S30（GAPPADTGP3000） is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an allnew 3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. Gap Pad 3000S30 maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.
Gap Pad 3000S30 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers.The material’s natural inherent tack allows for stick-in-place characteristics during assembly. Gap Pad 3000S30 is supplied with protective liners on both sides.The top side has reduced tack for ease of handling.